Product
Honor Pad X8
Honor Pad X8
₹19,359
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Battery
Type Li-Po 5100 mAh Li-Ion 5000 mAh, non-removable
Body
Dimensions 240.2 x 159 x 7.6 mm (9.46 x 6.26 x 0.30 in) 206.6 x 126.7 x 8.9 mm (8.13 x 4.99 x 0.35 in)
SIM No Nano-SIM
Weight 460 g (1.01 lb) 358 g (12.63 oz)
Comms
Bluetooth 5.1, A2DP, LE 4.2, A2DP
NFC No No
Positioning GPS, GLONASS, BDS GPS, GLONASS
Radio No No
USB USB Type-C, OTG microUSB 2.0
WLAN Wi-Fi 802.11 a/b/g/n/ac, dual-band Wi-Fi 802.11 a/b/g/n, dual-band, Wi-Fi Direct
Display
Resolution 1200 x 1920 pixels, 16:10 ratio (~224 ppi density) 800 x 1280 pixels, 16:10 ratio (~189 ppi density)
Size 10.1 inches, 295.8 cm2 (~77.4% screen-to-body ratio) 8.0 inches, 185.6 cm2 (~70.9% screen-to-body ratio)
Type TFT LCD IPS LCD
Features
Sensors Accelerometer Accelerometer
  - ANT+
Launch
Announced 2022, September 17 2018, September. Released 2018, September
Status Available. Released 2022, September 22 Discontinued
Main Camera
Single 5 MP 5 MP, f/2.2, AF
Video 1080p@30fps 1080p@30fps
Memory
Card slot microSDXC (dedicated slot) microSDXC (dedicated slot)
Internal 32GB 3GB RAM, 64GB 4GB RAM, 128GB 6GB RAM 32GB 2GB RAM
  - eMMC 5.1
Misc
Colors Dark Blue, Light Blue Black
Models AGM3-W09HN SM-T387, SM-T387W, SM-T387V, SM-T387AA, SM-T387T
SAR - 1.29 W/kg (body)    
Network
2G bands N/A GSM 850 / 900 / 1800 / 1900
3G bands N/A HSDPA 850 / 1700(AWS) / 1900 / 2100 - Canada
4G bands N/A 1, 2, 3, 4, 5, 7, 12, 17, 29, 30, 66 - Canada
EDGE No -
GPRS No -
Speed - HSPA, LTE
Technology No cellular connectivity GSM / HSPA / LTE
  - 2, 3, 4, 5, 7, 13 - Verizon
Platform
Chipset MediaTek MT8786 Qualcomm MSM8917 Snapdragon 425 (28 nm)
CPU Octa-core (2x2.0 GHz Cortex-A75 & 6x1.8 GHz Cortex-A55) Quad-core 1.4 GHz Cortex-A53
GPU Mali-G52 Adreno 308
OS Android 10, Magic UI 4 Android 8.1 (Oreo)
Selfie camera
Single 2 MP 2 MP, f/2.2
Video
Sound
3.5mm jack No Yes
Loudspeaker Yes, with stereo speakers Yes
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